Invention Grant
- Patent Title: Heat dissipation system and related method
- Patent Title (中): 散热系统及相关方法
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Application No.: US11958066Application Date: 2007-12-17
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Publication No.: US07706144B2Publication Date: 2010-04-27
- Inventor: Thomas W. Lynch
- Applicant: Thomas W. Lynch
- Agency: Dorsey & Whitney LLP
- Main IPC: H05K7/20
- IPC: H05K7/20
Abstract:
Embodiments described herein may include example embodiments of methods, apparatuses, devices, and/or systems for heat dissipation.
Public/Granted literature
- US20090154106A1 DOUBLE BONDED HEAT DISSIPATION Public/Granted day:2009-06-18
Information query
