Invention Grant
- Patent Title: Assembly device for a computer case and outer cover
- Patent Title (中): 电脑外壳和外盖的组装装置
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Application No.: US11400183Application Date: 2006-04-10
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Publication No.: US07706145B2Publication Date: 2010-04-27
- Inventor: Richard Chen , Albert Hua
- Applicant: Richard Chen , Albert Hua
- Applicant Address: US CA San Jose
- Assignee: Super Micro Computer, Inc.
- Current Assignee: Super Micro Computer, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Jackson IPG PLLC
- Main IPC: H05K5/00
- IPC: H05K5/00

Abstract:
An assembly device for a computer case and outer cover incorporating: a host case provided with a bottom plate and perpendicular left and right side walls, a circuit motherboard fixed within the holding space, a jack panel of relatively small area and size is located at a tail end of the circuit motherboard, and an electrical circuit is printed on an inverse side of the jack panel; a rectangular outer cover, the outer cover can be assembled/disassembled to/from the rectangular gap of the host case, and the jack panel can be plugged into or withdrawn from the socket, thereby realizing a rapid and convenient method of assembling and disassembling the outer cover to and from the host case.
Public/Granted literature
- US20070236876A1 Assembly device for a computer case and outer cover Public/Granted day:2007-10-11
Information query