Invention Grant
- Patent Title: Power system module and method of fabricating the same
- Patent Title (中): 电力系统模块及其制造方法
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Application No.: US11696801Application Date: 2007-04-05
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Publication No.: US07706146B2Publication Date: 2010-04-27
- Inventor: Keun-hyuk Lee , Seung-won Lim , Seung-han Paek , Sung-min Park
- Applicant: Keun-hyuk Lee , Seung-won Lim , Seung-han Paek , Sung-min Park
- Applicant Address: KR Bucheon-Si
- Assignee: Fairchild Korea Semiconductor Ltd
- Current Assignee: Fairchild Korea Semiconductor Ltd
- Current Assignee Address: KR Bucheon-Si
- Agency: Hiscock & Barclay, LLP
- Agent Thomas R. FitzGerald
- Priority: KR10-2006-0035770 20060420
- Main IPC: H05K5/00
- IPC: H05K5/00

Abstract:
Provided are a power system module allowing a user's requirements to be easily met, and having economic practicality and high integration, and a manufacturing method thereof. The power system module includes a plastic case, a molding type power module package, a control circuit board, and at least one external terminal. The plastic case defines a bottom and a side wall. The molding type power module package is fixed to the bottom of the plastic case and includes at least a power device therein. The control circuit board is fixed to the side wall of the plastic case, includes at least a control device mounted thereon which is electrically connected to the power module package. The external terminal protrudes to outside the plastic case and is electrically connected to the control circuit board.
Public/Granted literature
- US20070284947A1 POWER SYSTEM MODULE AND METHOD OF FABRICATING THE SAME Public/Granted day:2007-12-13
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