Invention Grant
- Patent Title: Reconfigurable, fault tolerant, multistage interconnect network and protocol
- Patent Title (中): 可重配置,容错,多级互联网络和协议
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Application No.: US11230340Application Date: 2005-09-20
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Publication No.: US07706361B2Publication Date: 2010-04-27
- Inventor: Robert J. McMillen , M. Cameron Watson , David J. Chura
- Applicant: Robert J. McMillen , M. Cameron Watson , David J. Chura
- Applicant Address: US OH Miamisburg
- Assignee: Teradata US, Inc.
- Current Assignee: Teradata US, Inc.
- Current Assignee Address: US OH Miamisburg
- Agency: Gates & Cooper LLP
- Main IPC: H04Q11/00
- IPC: H04Q11/00

Abstract:
A multistage interconnect network (MIN) capable of supporting massive parallel processing, including point-to-point and multicast communications between processor modules (PMs) which are connected to the input and output ports of the network. The network is built using interconnected switch nodes arranged in 2 [logb N] stages, wherein b is the number of switch node input/output ports, N is the number of network input/output ports and [logb N] indicates a ceiling function providing the smallest integer not less than logb N. The additional stages provide additional paths between network input ports and network output ports, thereby enhancing fault tolerance and lessening contention.
Public/Granted literature
- US20060013207A1 Reconfigurable, fault tolerant, multistage interconnect network and protocol Public/Granted day:2006-01-19
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