Invention Grant
- Patent Title: Method for positioning a wafer
- Patent Title (中): 晶圆定位方法
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Application No.: US11815741Application Date: 2006-01-09
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Publication No.: US07706908B2Publication Date: 2010-04-27
- Inventor: Bart Scholte Van Mast , Holger Christ , Ruedi Schmucki
- Applicant: Bart Scholte Van Mast , Holger Christ , Ruedi Schmucki
- Applicant Address: LI Balzers
- Assignee: OC Oerlikon Balzers AG
- Current Assignee: OC Oerlikon Balzers AG
- Current Assignee Address: LI Balzers
- Agency: Notaro & Michalos P.C.
- Priority: CH309/05 20050222
- International Application: PCT/CH2006/000015 WO 20060109
- International Announcement: WO2006/089435 WO 20060831
- Main IPC: G06F19/00
- IPC: G06F19/00 ; H01L21/677

Abstract:
The invention relates to a method for positioning a wafer (3) with a reference mark (6) in a vacuum processing unit with a transport chamber containing a transport device (2, 20, 21) for moving the wafers (3) in a plane to a process chamber arranged on said chamber and a single sensor (1), arranged within the transport chamber before the process chamber for recording the position of the wafer (3) by means of recording the edge thereof at a first detection point (4) and a second detection point (5), such that the actual position of the wafer (12) with a known wafer diameter can be determined with electronic analysis of both measured detection points (4, 5) and the transport device (2, 20, 21) guides the wafer (3) to a desired set position. The wafer (3) is aligned in a given position on the transport device (2, 20, 21) in relation to the reference marks (6) thereof and the projection of the reference marks (6) determines a non-permitted zone (22) along a direction of movement on the wafer (3) and hence defines a free zone on the remainder of the wafer (3). The sensor (1) is arranged in the transport chamber such as to guarantee that the non-permitted zone (22) is not scanned and the sensor (1) can thus only record the circular art of the wafer edge and not parts of the reference mark (6).
Public/Granted literature
- US20080152474A1 Method for Positioning a Wafer Public/Granted day:2008-06-26
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