Invention Grant
- Patent Title: Apparatus for assembling camera module
- Patent Title (中): 相机模组装置
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Application No.: US11889497Application Date: 2007-08-14
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Publication No.: US07707712B2Publication Date: 2010-05-04
- Inventor: Duck Hun Kim
- Applicant: Duck Hun Kim
- Applicant Address: KR Suwon-Si
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-Si
- Agency: Staas & Halsey LLP
- Priority: KR10-2006-0077674 20060817
- Main IPC: H05K3/30
- IPC: H05K3/30

Abstract:
Provided is an apparatus for assembling a camera module comprising a support frame that is formed in a rectangular shape and has a jig horizontally connected to an upper end thereof; a plurality of stages that are vertically stacked and installed in the support frame and adjust a printed circuit board (PCB) in three-axis directions; a board holder that is formed to extend from one end of the uppermost stage and has the PCB mounted on the extending end thereof; and a jig assembly that is disposed on an opening of the jig and has a barrel-integrated housing mounted on the central portion thereof.
Public/Granted literature
- US20080042333A1 Apparatus and method for assembling camera module Public/Granted day:2008-02-21
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