Invention Grant
- Patent Title: Pressure sensor
- Patent Title (中): 压力传感器
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Application No.: US12172045Application Date: 2008-07-11
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Publication No.: US07707892B2Publication Date: 2010-05-04
- Inventor: Seizo Fujimoto
- Applicant: Seizo Fujimoto
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2006-142843 20060523
- Main IPC: G01L7/00
- IPC: G01L7/00

Abstract:
A mounting structure for a pressure sensor serves to facilitate easy attachment of the pressure sensor as well as easy detachment thereof without requiring any large work space. A pair of elastic snap fit portions (8) are formed on a surge tank (4) so as to protrude from a surface thereof, and have engagement protrusions (8a) formed at their one end, respectively, so as to protrude to a side opposite to a case (2). A pair of engaged portions (2b) are formed on the case (2) so as to be engaged with the engagement protrusions (8a), respectively. The snap fit portions (8) are forced to flexibly deform to the pressure sensor (1) when the pressure sensor (1) is attached to and detached from the surge tank (4).
Public/Granted literature
- US20080302189A1 PRESSURE SENSOR Public/Granted day:2008-12-11
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