Invention Grant
- Patent Title: Force sensor chip
- Patent Title (中): 力传感器芯片
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Application No.: US12000405Application Date: 2007-12-12
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Publication No.: US07707899B2Publication Date: 2010-05-04
- Inventor: Nobuhiro Sakurai , Takeshi Ohsato
- Applicant: Nobuhiro Sakurai , Takeshi Ohsato
- Applicant Address: JP Tokyo
- Assignee: Honda Motor Co., Ltd.
- Current Assignee: Honda Motor Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch, & Birch LLP
- Priority: JPP2006-334679 20061212
- Main IPC: G01L1/22
- IPC: G01L1/22 ; G01D7/00
Abstract:
A force sensor chip including a semiconductor substrate having a plurality of strain resistance elements and temperature-compensating resistance elements corresponding to the resistance elements is disclosed. The structure in the periphery of parts where the strain resistance elements, which are provided to deforming parts in the action part formed on the semiconductor substrate, are disposed is the same as the structure in the periphery of parts where the temperature-compensating resistance elements in the action part are disposed.
Public/Granted literature
- US20080156112A1 Force sensor chip Public/Granted day:2008-07-03
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