Invention Grant
- Patent Title: Molding apparatus for wet friction material
- Patent Title (中): 湿摩擦材料成型设备
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Application No.: US11806035Application Date: 2007-05-29
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Publication No.: US07708044B2Publication Date: 2010-05-04
- Inventor: Masayuki Mizuno , Wataru Tomita
- Applicant: Masayuki Mizuno , Wataru Tomita
- Applicant Address: JP Toyota-Shi, Aichi-Ken
- Assignee: Aisin Kako Kabushiki Kaisha
- Current Assignee: Aisin Kako Kabushiki Kaisha
- Current Assignee Address: JP Toyota-Shi, Aichi-Ken
- Agency: Buchanan Ingersoll & Rooney PC
- Priority: JP2006-149549 20060530
- Main IPC: B32B37/00
- IPC: B32B37/00

Abstract:
A molding apparatus of a wet friction material has a pair of guide posts vertically extending on a molding apparatus main body. The pair of the guide posts passes through fifteen stages (sixteen pieces) of molding dies. A pair of pantograph-type open-close mechanisms is attached to opposite side surfaces of the molding dies. Thus, the molding dies are piled up on each other so as to come near to each other (mold clamping) and move apart from each other (mold opening). With the pantograph-type open-close link mechanism, all the molding dies are opened and closed at the same time. If the molding dies are slid at a speed of 200 mm/sec, it takes only 3.75 seconds (50 mm*15/200 mm=3.75 sec). It takes a double of that time or 7.5 seconds, that is a half of the time of a related art.
Public/Granted literature
- US20080175945A1 Molding apparatus for wet friction material Public/Granted day:2008-07-24
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