Invention Grant
- Patent Title: Coil support
- Patent Title (中): 线圈支持
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Application No.: US11336650Application Date: 2006-01-20
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Publication No.: US07708052B2Publication Date: 2010-05-04
- Inventor: Derek A. Leman , Christopher J. Ingermann , Loren D. Hoffman , Frank J. David , John A. Wade , Larry D. Burns , Nancy O. Ashcraft , Brian L. DePerro
- Applicant: Derek A. Leman , Christopher J. Ingermann , Loren D. Hoffman , Frank J. David , John A. Wade , Larry D. Burns , Nancy O. Ashcraft , Brian L. DePerro
- Applicant Address: US CT Farmington
- Assignee: Carrier Corporation
- Current Assignee: Carrier Corporation
- Current Assignee Address: US CT Farmington
- Agency: Kinney & Lange, P.A.
- Main IPC: F28F7/00
- IPC: F28F7/00 ; F21D21/14
Abstract:
A coil support suitable for supporting a coil in a condensing unit includes a body and a protrusion extending from the body. The protrusion is configured to limit movement of the coil in at least one direction.
Public/Granted literature
- US20070169925A1 Coil support Public/Granted day:2007-07-26
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