Invention Grant
- Patent Title: Acoustic diaphragm and method for manufacturing an acoustic diaphragm
- Patent Title (中): 声膜和制造声膜的方法
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Application No.: US11486003Application Date: 2006-07-14
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Publication No.: US07708111B2Publication Date: 2010-05-04
- Inventor: Masaru Uryu , Kunihiko Tokura , Takahisa Tagami , Emiko Ikeda
- Applicant: Masaru Uryu , Kunihiko Tokura , Takahisa Tagami , Emiko Ikeda
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2005-211525 20050721
- Main IPC: G10K13/00
- IPC: G10K13/00 ; H04R7/10 ; H04R7/02 ; H04R7/06
Abstract:
There is provided an acoustic diaphragm which includes a diaphragm base material composed of a paper article comprised of fine mica flakes, pulp fibers, and polyvinyl alcohol fibers and formed to be a multi-cellular structure; and a sheet material combined with the paper article or the diaphragm base material.
Public/Granted literature
- US20070017737A1 Acoustic diaphragm and method for manufacturing an acoustic diaphragm Public/Granted day:2007-01-25
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