Invention Grant
- Patent Title: Reflow solder oven with cooling diffuser
- Patent Title (中): 回流焊炉带冷却散热器
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Application No.: US12057876Application Date: 2008-03-28
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Publication No.: US07708183B2Publication Date: 2010-05-04
- Inventor: Jonathan M. Dautenhahn
- Applicant: Jonathan M. Dautenhahn
- Applicant Address: US IL Glenview
- Assignee: Illinois Tool Works Inc.
- Current Assignee: Illinois Tool Works Inc.
- Current Assignee Address: US IL Glenview
- Agency: Thompson Hine LLP
- Main IPC: B23K1/00
- IPC: B23K1/00 ; F27D15/02 ; F27B9/02
Abstract:
A diffuser plate for a reflow oven includes an upper surface and a plurality of nozzle openings therein. Each of the plurality of nozzle openings has a raised surrounding portion for restricting condensed flux on the upper surface of the diffuser plate from flowing through the nozzles. A drain hole permits condensed flux on the upper surface to flow downward through the plate.
Public/Granted literature
- US20090242616A1 REFLOW SOLDER OVEN WITH COOLING DIFFUSER Public/Granted day:2009-10-01
Information query
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