A clamp used to create a bond between under floor wiring systems and a common bonding network is disclosed. The clamp includes a mounting bracket, a J-bolt and a split bolt for securing wires to the mounting bracket. The mounting bracket has a main body with an aperture and a slot. The J-bolt has a first end and a second end. The first end of the J-bolt is attached at the aperture of the mounting bracket and the second end of the J-bolt is positioned within the slot of the mounting bracket. The second end of the J-bolt is removed from the slot to enable the second end of the J-bolt to pivot away from the mounting bracket enabling the J-bolt to engage a floor pedestal.