Invention Grant
US07708366B2 Liquid ejection apparatus, liquid ejection system, and liquid ejection method
有权
液体喷射装置,液体喷射系统和液体喷射方法
- Patent Title: Liquid ejection apparatus, liquid ejection system, and liquid ejection method
- Patent Title (中): 液体喷射装置,液体喷射系统和液体喷射方法
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Application No.: US12024840Application Date: 2008-02-01
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Publication No.: US07708366B2Publication Date: 2010-05-04
- Inventor: Hironori Endo
- Applicant: Hironori Endo
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2003-110842 20030415
- Main IPC: B41J29/38
- IPC: B41J29/38

Abstract:
A liquid ejection apparatus, a liquid ejection system, and a liquid ejection method are achieved which allow starting and ending positions for ejecting liquid to be set appropriately. A controller is provided which executes position determination control for determining at least one of the starting position and the ending position for ejecting liquid from a moving ejection head onto a medium that is fed by a feed mechanism, wherein the position determination control by the controller differs for when ejecting the liquid from the ejection head to a region within a predetermined range from a front edge or a rear edge, in a feed direction, of the medium, and for when ejecting the liquid from the ejection head to a central region, in the feed direction, of the medium.
Public/Granted literature
- US20080150992A1 LIQUID EJECTION APPARATUS, LIQUID EJECTION SYSTEM, AND LIQUID EJECTION METHOD Public/Granted day:2008-06-26
Information query
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