Invention Grant
- Patent Title: Optical module holder, optical module, and optical connector
- Patent Title (中): 光模块支架,光模块和光连接器
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Application No.: US12075640Application Date: 2008-03-13
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Publication No.: US07708472B2Publication Date: 2010-05-04
- Inventor: Toshiharu Sumi , Shimpei Morioka
- Applicant: Toshiharu Sumi , Shimpei Morioka
- Applicant Address: JP Saitama
- Assignee: Enplas Corporation
- Current Assignee: Enplas Corporation
- Current Assignee Address: JP Saitama
- Agent William L. Androlia; H. Henry Koda
- Priority: JP2007-065110 20070314; JP2007-235319 20070911; JP2008-002193 20080109
- Main IPC: G02B6/42
- IPC: G02B6/42

Abstract:
It is to enhance mass-productivity through quick adhesion of an optical element 11 to an optical module holder 14 using an ultraviolet curable adhesive 7. When an optical element 11 is adhered to an optical element attaching section 5 by an ultraviolet curable adhesive 7 through ultraviolet rays being irradiated onto the ultraviolet curable adhesive 7 applied onto a predetermined application surface 5a on an inner circumferential surface of the optical element attaching section 5 from an outer side of the optical element attaching section 5, a thin-walled section 20 for maintaining a transmittance of the ultraviolet rays transmitted through the optical element attaching section 5 at a predetermined value or higher is formed on the optical element attaching section 5.
Public/Granted literature
- US20080226238A1 Optical module holder, optical module, and optical connector Public/Granted day:2008-09-18
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