An electronic assembly includes an enclosure including a top cover and a bottom cover, and a thermal module arranged between the top cover and the bottom cover of the enclosure. The thermal module includes a centrifugal blower and a fin assembly arranged in an air outlet of the centrifugal blower. The centrifugal blower includes a top lid defining a first air inlet therein, a bottom plate defining a second air inlet therein, a sidewall disposed between the top lid and the bottom plate, with the air outlet defined in the sidewall, and a rotor disposed in an inner space formed between the top lid, the bottom plate and the sidewall. The bottom plate is separated by a distance from the bottom cover of the enclosure. The bottom plate defines an indent therein so as to widen the distance.