Invention Grant
- Patent Title: Injection molding machine
- Patent Title (中): 注塑机
-
Application No.: US12123695Application Date: 2008-05-20
-
Publication No.: US07708540B2Publication Date: 2010-05-04
- Inventor: Hiroshi Watanabe , Nobuto Takeda
- Applicant: Hiroshi Watanabe , Nobuto Takeda
- Applicant Address: JP Yamanashi
- Assignee: Fanuc Ltd
- Current Assignee: Fanuc Ltd
- Current Assignee Address: JP Yamanashi
- Agency: Lowe Hauptman Ham & Berner LLP
- Priority: JP2007-140478 20070528
- Main IPC: B29C45/80
- IPC: B29C45/80

Abstract:
An injection molding machine that performs a safe ejecting action of a molded article until a setting state of an ejector rod and a set forward end position for an ejection stroke of a molded article ejector are suitable for a mold in use. A resistor R1 is set to ON when a mold is changed and a resistor R2 is set to ON when a set value of the forward end position of the ejection stroke is changed. When resistor R1 or resistor R2 is ON, ejection is performed with a reduced ejecting force and at a reduced ejecting velocity. When a detected position of the ejector rod reaches the set forward end position, resistors R1 and R2 are turned OFF and thereafter the ejection is performed with a normal ejecting force and a normal ejecting velocity, to thereby prevent damage to the mold or to the molded article ejector.
Public/Granted literature
- US20080299242A1 INJECTION MOLDING MACHINE Public/Granted day:2008-12-04
Information query