An arrangement for connecting an electronic subassembly and an optical subassembly in an electro-optical communication device such as an electro-optical transceiver. The arrangement includes a body of a rigid dielectric material for mounting e.g. on the optical subassembly. The body has electrically conductive pathways provided thereon and includes a shaped portion providing a socket-like formation. At least one electrical contact element is coupled with e.g. the electronic subassembly. The electrical contact element is pluggable into the socket-like formation of the body of rigid dielectric material and includes an elastic device adapted to elastically co-operate with the socket-like formation of the body of rigid dielectric material to retain the electrical contact element plugged in the socket-like formation to provide electrical contact with the electrically conductive pathways provide thereon, while permitting vibrational displacement of the electrical contact element within the socket-like formation.