Invention Grant
- Patent Title: Semiconductor circuit arrangement
- Patent Title (中): 半导体电路布置
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Application No.: US11756072Application Date: 2007-05-31
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Publication No.: US07708584B2Publication Date: 2010-05-04
- Inventor: Martin Hierholzer , Patrick Baginski , Michael Hornkamp , Uwe Jansen
- Applicant: Martin Hierholzer , Patrick Baginski , Michael Hornkamp , Uwe Jansen
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Dicke, Billig & Czaja, PLLC
- Priority: DE102006025453 20060531
- Main IPC: H01R13/00
- IPC: H01R13/00
Abstract:
A semiconductor circuit arrangement is disclosed. In one embodiment, a semiconductor module is attached to a board using a screw, with a mechanical and electrical contact being made between module contacts on the semiconductor module and associated board contacts on the board at the same time by attachment using the screw.
Public/Granted literature
- US20070278669A1 SEMICONDUCTOR CIRCUIT ARRANGEMENT Public/Granted day:2007-12-06
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