Invention Grant
- Patent Title: Method for molding synthetic resin structure
- Patent Title (中): 合成树脂结构成型方法
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Application No.: US10906332Application Date: 2005-02-15
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Publication No.: US07708922B2Publication Date: 2010-05-04
- Inventor: Takehiro Matsuda
- Applicant: Takehiro Matsuda
- Applicant Address: JP Tokyo
- Assignee: Pioneer Corporation
- Current Assignee: Pioneer Corporation
- Current Assignee Address: JP Tokyo
- Agency: Kratz, Quintos & Hanson, LLP
- Priority: JP2004-041752 20040218
- Main IPC: B29C45/14
- IPC: B29C45/14 ; B29C70/72
Abstract:
At the time of insert molding of suspension bases (500), areas of junction parts of the suspension bases (500) and flat plates (560) which are directly affected by fluidized synthetic resin when the synthetic resin is injected are varied independently so as to correct strain of suspensions (550).
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