Invention Grant
- Patent Title: Adhesive pattern for a label system
- Patent Title (中): 标签系统的粘合剂图案
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Application No.: US10739626Application Date: 2003-12-18
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Publication No.: US07709072B2Publication Date: 2010-05-04
- Inventor: Jack E. Caveney , Barry O. Page , David P. Newman
- Applicant: Jack E. Caveney , Barry O. Page , David P. Newman
- Applicant Address: US IL Tinley Park
- Assignee: Panduit Corp.
- Current Assignee: Panduit Corp.
- Current Assignee Address: US IL Tinley Park
- Agent Robert A. McCann; Christopher S. Clancy; James H. Williams
- Main IPC: B32B9/00
- IPC: B32B9/00 ; B32B33/00 ; B32B23/02 ; B32B7/14 ; B32B7/06 ; B32B27/32 ; B42D15/00

Abstract:
An adhesive pattern for a label system is disclosed. The adhesive pattern includes a label sheet having a plurality of non-adhesive sections, and a plurality of adhesive sections connected to the non-adhesive sections. The non-adhesive sections and the adhesive sections are in alternate arrangement to form the label sheet. The label sheet also includes a plurality of labels having a first end and a second end, and the first end is attached to a non-adhesive section. Upon removal of the label from a non-adhesive section, the label has a non-sticking surface.
Public/Granted literature
- US20040128893A1 Adhesive pattern for a label system Public/Granted day:2004-07-08
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