Invention Grant
US07709093B2 Coatings with improved chip resistance and methods of making the same
有权
具有改善的芯片电阻的涂层及其制造方法
- Patent Title: Coatings with improved chip resistance and methods of making the same
- Patent Title (中): 具有改善的芯片电阻的涂层及其制造方法
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Application No.: US10982074Application Date: 2004-11-05
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Publication No.: US07709093B2Publication Date: 2010-05-04
- Inventor: Michael P. Makowski , Jonathan T. Martz , Carolyn A. Novak , Christopher A. Verardi
- Applicant: Michael P. Makowski , Jonathan T. Martz , Carolyn A. Novak , Christopher A. Verardi
- Applicant Address: US OH Cleveland
- Assignee: PPG Industries Ohio, Inc.
- Current Assignee: PPG Industries Ohio, Inc.
- Current Assignee Address: US OH Cleveland
- Agent Robert A. Diaz
- Main IPC: B32B27/40
- IPC: B32B27/40 ; C08G18/00

Abstract:
A coating composition, formed of a film-forming component comprising a functional group-containing resinous binder and, optionally, a crosslinking agent having at least two functional groups that are reactive with the functional groups of the film-forming component, wherein, when the composition is applied and cured to form a cured coating, the cured coating is characterized as having a bicontinuous morphology. Methods of making the coating composition and coatings prepared therefrom are also provided. The coating composition can provide improved physical properties, such as chip resistance, when incorporated into a coating.
Public/Granted literature
- US20050123684A1 Coatings with improved chip resistance and methods of making the same Public/Granted day:2005-06-09
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