Invention Grant
- Patent Title: Method and device for manufacturing relief printing plate terminal for seamless printing
- Patent Title (中): 用于无缝印刷的凸版印版终端的制造方法和装置
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Application No.: US10563833Application Date: 2004-04-30
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Publication No.: US07709183B2Publication Date: 2010-05-04
- Inventor: Miyoshi Watanabe , Tomohiro Kishida
- Applicant: Miyoshi Watanabe , Tomohiro Kishida
- Applicant Address: JP Tokyo
- Assignee: Asahi Kasei Chemicals Corporation
- Current Assignee: Asahi Kasei Chemicals Corporation
- Current Assignee Address: JP Tokyo
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
- Priority: JP2003-272490 20030709
- International Application: PCT/JP2004/005839 WO 20040430
- International Announcement: WO2005/005147 WO 20050120
- Main IPC: G03F7/26
- IPC: G03F7/26

Abstract:
A workpiece 70 is set to holding rotating means and then liquid-state photosensitive resin 10 is supplied to a resin applying smoothing unit 150 to mold the workpiece 70 into a uniform thickness while rotating the workpiece 70 and applying the liquid-state photosensitive resin 10 to the outer periphery of the workpiece 70 by the resin applying smoothing unit 150. Moreover, while rotating the workpiece 70, liquid-state photosensitive resin, it is exposed by high-intensity ultraviolet light 30 and thereby, the surface of the photo-cured photosensitive resin is shaped to remove an unnecessary resin layer. Then, laser carving is performed by an infrared laser beam 40 to perform post-treatment.
Public/Granted literature
- US20060230964A1 Method and device for manufacturing relief printing plate terminal for seamless printing Public/Granted day:2006-10-19
Information query
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