Invention Grant
- Patent Title: Method of manufacturing a semiconductor device having an insulating protective film covering at least a portion of a tile-shaped element
- Patent Title (中): 制造具有覆盖瓦片状元件的至少一部分的绝缘保护膜的半导体器件的方法
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Application No.: US12000427Application Date: 2007-12-12
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Publication No.: US07709283B2Publication Date: 2010-05-04
- Inventor: Takayuki Kondo
- Applicant: Takayuki Kondo
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JP2002-180036 20020620
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
The invention provides a semiconductor device, a method of manufacturing the same, an electro-optic device and an electronic apparatus which are capable of addressing or solving a problem of mechanical mounting of a semiconductor element chip on a substrate. A semiconductor device includes a tile-shaped microelement bonded to a substrate, and an insulating functional film provided to cover at least a portion of the tile-shaped microelement.
Public/Granted literature
- US20080277671A1 Semiconductor device, method of manufacturing the same, electro-optic device and electronic apparatus Public/Granted day:2008-11-13
Information query
IPC分类:
