Invention Grant
- Patent Title: Selectively altering a predetermined portion or an external member in contact with the predetermined portion
- Patent Title (中): 选择性地改变与预定部分接触的预定部分或外部构件
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Application No.: US11779423Application Date: 2007-07-18
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Publication No.: US07709298B2Publication Date: 2010-05-04
- Inventor: Zhiyong Li
- Applicant: Zhiyong Li
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Main IPC: H01L21/82
- IPC: H01L21/82
Abstract:
A method for selectively altering a predetermined portion of an object or an external member in contact with the predetermined portion of the object is disclosed. The method includes selectively electrically addressing the predetermined portion, thereby locally resistive heating the predetermined portion, and exposing the object, including the predetermined portion, to the external member.
Public/Granted literature
Information query
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