Invention Grant
US07709303B2 Process for forming an electronic device including a fin-type structure
有权
用于形成包括翅片型结构的电子设备的方法
- Patent Title: Process for forming an electronic device including a fin-type structure
- Patent Title (中): 用于形成包括翅片型结构的电子设备的方法
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Application No.: US11328668Application Date: 2006-01-10
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Publication No.: US07709303B2Publication Date: 2010-05-04
- Inventor: James D. Burnett , Leo Mathew , Byoung W. Min
- Applicant: James D. Burnett , Leo Mathew , Byoung W. Min
- Applicant Address: US TX Austin
- Assignee: Freescale Semiconductor, Inc.
- Current Assignee: Freescale Semiconductor, Inc.
- Current Assignee Address: US TX Austin
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
A process for forming an electronic device can include forming a semiconductor fin of a first height for a fin-type structure and removing a portion of the semiconductor fin such that the semiconductor fin is shortened to a second height. In accordance with specific embodiment a second semiconductor fin can be formed, each of the first and the second semiconductor fins having a different height representing a channel width. In accordance with another specific embodiment a second and a third semiconductor fin can be formed, each of the first, the second and the third semiconductor fins having a different height representing a channel width.
Public/Granted literature
- US20070161171A1 Process for forming an electronic device including a fin-type structure Public/Granted day:2007-07-12
Information query
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