Invention Grant
- Patent Title: Semiconductor device and method for fabricating same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US11529381Application Date: 2006-09-29
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Publication No.: US07709328B2Publication Date: 2010-05-04
- Inventor: Kang Sik Choi
- Applicant: Kang Sik Choi
- Applicant Address: KR Icheon-si
- Assignee: Hynix Semiconductor Inc.
- Current Assignee: Hynix Semiconductor Inc.
- Current Assignee Address: KR Icheon-si
- Agency: Townsend and Townsend and Crew LLP
- Priority: KR10-2006-0034051 20060414
- Main IPC: H01L21/336
- IPC: H01L21/336

Abstract:
The semiconductor device includes a device isolation structure formed in a semiconductor substrate to define an active region, a bridge type channel structure formed in the active region, and a coaxial type gate electrode surrounding the bridge type channel structure of a gate region. The bridge type channel structure is separated from the semiconductor substrate thereunder by a predetermined distance in a vertical direction.
Public/Granted literature
- US20070241420A1 Semiconductor device and method for fabricating same Public/Granted day:2007-10-18
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