Invention Grant
- Patent Title: Film forming method, and substrate-processing apparatus
- Patent Title (中): 成膜方法和基板处理装置
-
Application No.: US11034926Application Date: 2005-01-14
-
Publication No.: US07709383B2Publication Date: 2010-05-04
- Inventor: Hirokazu Kato , Tomoyuki Takeishi , Shinichi Ito
- Applicant: Hirokazu Kato , Tomoyuki Takeishi , Shinichi Ito
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
- Priority: JP2004-008306 20040115
- Main IPC: H01L21/20
- IPC: H01L21/20 ; H01L21/44
Abstract:
A film forming method comprising forming a liquid coating film on a substrate by supplying a liquid containing a coating type thin film forming substance and a solvent onto the substrate, substantially converging a variation in film thickness of the coating film, making the coating film stand by in an atmosphere including moisture under a predetermined condition after the substantial-convergence, the predetermined condition being such that a product of a time for which the coating film is exposed to the atmosphere and a water content per unit volume in an atmosphere in the vicinity of a surface of the coating film is made to be greater than or equal to a predetermined value, and forming a solid thin film on the substrate after the stand-by, the thin film being formed by carrying out an elimination of the solvent in the coating film and heat treatment for generating an irreversible reaction to the coating type thin film forming substance in the coating film.
Public/Granted literature
- US20050208777A1 Film forming method, and substrate-processing apparatus Public/Granted day:2005-09-22
Information query
IPC分类:
