Invention Grant
- Patent Title: Adhesive-less DC bus system and method for manufacturing
- Patent Title (中): 无粘合剂直流母线系统及其制造方法
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Application No.: US11460399Application Date: 2006-07-27
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Publication No.: US07709737B2Publication Date: 2010-05-04
- Inventor: Jeremy J Keegan , Scott D. Day , William K. Siebert
- Applicant: Jeremy J Keegan , Scott D. Day , William K. Siebert
- Applicant Address: US OH Mayfield Heights
- Assignee: Rockwell Automation Technologies, Inc.
- Current Assignee: Rockwell Automation Technologies, Inc.
- Current Assignee Address: US OH Mayfield Heights
- Agency: Quarles & Brady LLP
- Agent Alexander R. Kuszewski; John M. Miller
- Main IPC: H02G5/00
- IPC: H02G5/00 ; H02B1/20

Abstract:
A system and method for manufacturing a power bus assembly is provided. The power bus assembly includes a first conductive sheet configured to receive a positive charge and distribute the positive charge to a plurality of connection points formed thereon. The power bus assembly also includes a second conductive sheet configured to receive a negative charge and distribute the negative charge to a plurality of connection points formed thereon. Additionally, the power bus assembly includes an insulating sheet arranged between the first conductive sheet and the second conductive sheet to electrically isolate the first conductive sheet from the second conductive sheet. A plurality of vice fasteners are included to secure the first conductive sheet, the second conductive sheet, and the insulating sheet together to form the power bus assembly.
Public/Granted literature
- US20080024959A1 Adhesive-Less DC Bus System and Method for Manufacturing Public/Granted day:2008-01-31
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