Invention Grant
US07709766B2 System and method for manufacturing embedded conformal electronics
有权
用于制造嵌入式保形电子的系统和方法
- Patent Title: System and method for manufacturing embedded conformal electronics
- Patent Title (中): 用于制造嵌入式保形电子的系统和方法
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Application No.: US10491609Application Date: 2003-08-05
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Publication No.: US07709766B2Publication Date: 2010-05-04
- Inventor: Richard Gambino , Jon Longtin , Sanjay Sampath
- Applicant: Richard Gambino , Jon Longtin , Sanjay Sampath
- Applicant Address: US NY Stony Brook
- Assignee: Research Foundation of the State University of New York
- Current Assignee: Research Foundation of the State University of New York
- Current Assignee Address: US NY Stony Brook
- Agency: F. Chau & Associates, LLC
- International Application: PCT/US03/24584 WO 20030805
- International Announcement: WO2004/013900 WO 20040212
- Main IPC: B23K26/38
- IPC: B23K26/38
Abstract:
A method for fabricating an electronic device comprises providing a substrate (501), direct writing a functional material by a thermal spray on the substrate (502) and removing a portion of the function material to form the electronic or sensory device (503).
Public/Granted literature
- US20050029236A1 System and method for manufacturing embedded conformal electronics Public/Granted day:2005-02-10
Information query
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