Vertically integrated field-effect transistor having a nanostructure therein

Invention Grant

US07709827B2 Vertically integrated field-effect transistor having a nanostructure therein 失效

Title translation: 其中具有纳米结构的垂直集成的场效应晶体管

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Patent Title: Vertically integrated field-effect transistor having a nanostructure therein
Patent Title (中): 其中具有纳米结构的垂直集成的场效应晶体管
Application No.: US10533550

Application Date: 2003-10-29
Publication No.: US07709827B2

Publication Date: 2010-05-04
Inventor: Andrew Graham , Franz Hofmann , Wolfgang Hönlein , Johannes Kretz , Franz Kreupl , Erhard Landgraf , Johannes Richard Luyken , Wolfgang Rösner , Thomas Schulz , Michael Specht
Applicant: Andrew Graham , Franz Hofmann , Wolfgang Hönlein , Johannes Kretz , Franz Kreupl , Erhard Landgraf , Johannes Richard Luyken , Wolfgang Rösner , Thomas Schulz , Michael Specht
Applicant Address: DE Munich
Assignee: Qimonda, AG
Current Assignee: Qimonda, AG
Current Assignee Address: DE Munich
Agency: Dicke, Billig & Czaja, PLLC
Priority: DE10250868 20021031
International Application: PCT/DE03/03587 WO 20031029
International Announcement: WO2004/040666 WO 20040513
Main IPC: H01L21/8238
IPC: H01L21/8238

Vertically integrated field-effect transistor having a nanostructure therein

Abstract:

The invention relates to a vertical integrated component, a component arrangement and a method for production of a vertical integrated component. The vertical integrated component has a first electrical conducting layer, a mid layer, partly embodied from dielectric material on the first electrical conducting layer, a second electrical conducting layer on the mid layer and a nanostructure integrated in a through hold introduced in the mid layer. A first end section of the nanostructure is coupled to the first electrical conducting layer and a second end section is coupled to the second electrical conducting layer. The mid layer includes a third electrical conducting layer between two adjacent dielectric partial layers, the thickness of which is less than the thickness of at least one of the dielectric partial layers.

Abstract(Chinese):

本发明涉及垂直集成部件，部件布置和用于生产垂直集成部件的方法。垂直集成部件具有第一导电层，中间层，其部分地由第一导电层上的介电材料实现，中间层上的第二导电层和集成在中间层中的贯通保持件中的纳米结构。纳米结构的第一端部分耦合到第一导电层，第二端部分耦合到第二导电层。中间层包括在两个相邻的介电部分层之间的第三导电层，其厚度小于介电部分层中的至少一个的厚度。

Public/Granted literature

US20060128088A1 Vertical integrated component, component arrangement and method for production of a vertical integrated component Public/Granted day:2006-06-15

Information query

Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L21/00	专门适用于制造或处理半导体或固体器件或其部件的方法或设备
H01L21/70	.由在一共用基片内或其上形成的多个固态组件或集成电路组成的器件或其部件的制造或处理；集成电路器件或其特殊部件的制造（由预制电组件组成的组装件的制造入H05K3/00，H05K13/00）
H01L21/77	..在公共衬底中或上面形成的由许多固态元件或集成电路组成的器件的制造或处理（电可编程只读存储器或其多步骤的制造方法入H01L27/115）
H01L21/78	...把衬底连续地分成多个独立的器件（改变表面物理特性或者半导体形状的切割入H01L21/304）
H01L21/82	....制造器件，例如每一个由许多元件组成的集成电路
H01L21/822	.....衬底是采用硅工艺的半导体的（H01L21/8258优先）
H01L21/8232	......场效应工艺
H01L21/8234	.......MIS工艺
H01L21/8238	........互补场效应晶体管，例如CMOS