An embodiment mitigates one or more of the limiting factors of fabricating polymer ferroelectric memory devices. For example, an embodiment reduces the degradation of the ferroelectric polymer due to the polymer's reaction with, and migration or diffusion of, adjacent metal electrode material. Further, the ferroelectric polymer is exposed to fewer potentially high temperature or high energy processes that may damage the polymer. An embodiment further incorporates an immobilized catalyst to improve the adhesion between adjacent layers, and particularly between the electrolessly plated electrodes and the ferroelectric polymer.