Invention Grant
- Patent Title: Semiconductor device having insulating stripe patterns
- Patent Title (中): 半导体器件具有绝缘条纹图案
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Application No.: US10357381Application Date: 2003-02-04
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Publication No.: US07709895B2Publication Date: 2010-05-04
- Inventor: Shunpei Yamazaki , Atsuo Isobe , Hidekazu Miyairi , Hideomi Suzawa
- Applicant: Shunpei Yamazaki , Atsuo Isobe , Hidekazu Miyairi , Hideomi Suzawa
- Applicant Address: JP Atsugi-shi, Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi-shi, Kanagawa-ken
- Agency: Robinson Intellectual Property Law Office, P.C.
- Agent Eric J. Robinson
- Priority: JP2002-033262 20020208
- Main IPC: H01L27/12
- IPC: H01L27/12

Abstract:
An uneven portion is formed on a substrate extending in a linear shape stripe pattern, convex portions of an insulating film that intersects with a crystalline semiconductor film divided into island shapes are removed, and an amorphous semiconductor film is formed on the insulating film. The semiconductor film is melted and flows into concave portions of the insulating film, where it crystallizes, and the semiconductor film that remains on the convex portions of the insulating film is removed. A semiconductor film divided into island shapes is then formed from the semiconductor film formed in the concave portions, the convex portions of the insulating film are removed in portions where channel forming regions are to be formed, thus exposing side surface portions of the semiconductor film. A gate insulating film and a gate electrode contacting the side surface portions and upper surface portions of the semiconductor film are then formed.
Public/Granted literature
- US20030209710A1 Semiconductor device and method of manufacturing the semiconductor device Public/Granted day:2003-11-13
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