Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US11892053Application Date: 2007-08-20
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Publication No.: US07709900B2Publication Date: 2010-05-04
- Inventor: Daisaku Ikoma , Atsuhiro Kajiya , Katsuhiro Ootani , Kyoji Yamashita
- Applicant: Daisaku Ikoma , Atsuhiro Kajiya , Katsuhiro Ootani , Kyoji Yamashita
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP2004-213903 20040722
- Main IPC: H01L23/62
- IPC: H01L23/62

Abstract:
A semiconductor device includes a semiconductor substrate; a diffusion region which is formed in the semiconductor substrate and serves as a region for the formation of a MIS transistor; an element isolation region surrounding the diffusion region; at least one gate conductor film which is formed across the diffusion region and the element isolation region, includes a gate electrode part located on the diffusion region and a gate interconnect part located on the element isolation region, and has a constant dimension in the gate length direction; and an interlayer insulating film covering the gate electrode. The semiconductor device further includes a gate contact which passes through the interlayer insulating film, is connected to the gate interconnect part, and has the dimension in the gate length direction larger than the gate interconnect part.
Public/Granted literature
- US20080042214A1 Semiconductor device Public/Granted day:2008-02-21
Information query
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