Invention Grant
- Patent Title: Contact barrier structure and manufacturing methods
- Patent Title (中): 接触屏障结构及制造方法
-
Application No.: US11807127Application Date: 2007-05-25
-
Publication No.: US07709903B2Publication Date: 2010-05-04
- Inventor: Ching-Ya Wang , Chung-Hu Ke , Wen-Chin Lee
- Applicant: Ching-Ya Wang , Chung-Hu Ke , Wen-Chin Lee
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L29/94
- IPC: H01L29/94

Abstract:
A semiconductor structure includes a semiconductor substrate; a gate dielectric over the semiconductor substrate; a gate electrode over the gate dielectric; a source/drain region adjacent the gate dielectric; a silicide region on the source/drain region; a metal layer on top of, and physical contacting, the silicide region; an inter-layer dielectric (ILD) over the metal layer; and a contact opening in the ILD. The metal layer is exposed through the contact opening. The metal layer further extends under the ILD. The semiconductor structure further includes a contact in the contact opening.
Public/Granted literature
- US20080290421A1 Contact barrier structure and manufacturing methods Public/Granted day:2008-11-27
Information query
IPC分类: