Invention Grant
- Patent Title: Solid-state image sensing device including anti-reflection structure including polysilicon and method of manufacturing the same
- Patent Title (中): 包括多晶硅的抗反射结构的固态图像感测装置及其制造方法
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Application No.: US11679614Application Date: 2007-02-27
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Publication No.: US07709919B2Publication Date: 2010-05-04
- Inventor: Getman Alexander , Bum-suk Kim , Yun-ho Jang , Sae-young Kim
- Applicant: Getman Alexander , Bum-suk Kim , Yun-ho Jang , Sae-young Kim
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronic Co., Ltd.
- Current Assignee: Samsung Electronic Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: F. Chau & Associates, LLC
- Priority: KR10-2006-0019585 20060228
- Main IPC: H01L31/0216
- IPC: H01L31/0216

Abstract:
A solid-state image sensing device including an anti-reflection structure that uses polysilicon and a method of manufacturing the same, in which the solid-state image sensing device includes a photodiode region and a transistor region. The photodiode region includes a semiconductor substrate, a first anti-refection layer, a second anti-reflection layer, and a top layer. The first anti-reflection layer is formed on the semiconductor substrate, and the second anti-reflection layer is formed on the first anti-reflection layer. The top layer is formed on the second anti-reflection layer. Each of the semiconductor substrate and the second anti-reflection layer is formed of a first material, and each of the first anti-reflection layer and the top layer is formed of a second material different from the first material.
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