Invention Grant
- Patent Title: Metal-base circuit board and its manufacturing method
- Patent Title (中): 金属基电路板及其制造方法
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Application No.: US10553076Application Date: 2004-04-15
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Publication No.: US07709939B2Publication Date: 2010-05-04
- Inventor: Naomi Yonemura , Katsunori Yashima , Yoshihiko Tsujimura , Hidenori Ishikura , Takashi Saiki
- Applicant: Naomi Yonemura , Katsunori Yashima , Yoshihiko Tsujimura , Hidenori Ishikura , Takashi Saiki
- Applicant Address: JP Tokyo
- Assignee: Denki Kagaku Kogyo Kabushiki Kaisha
- Current Assignee: Denki Kagaku Kogyo Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2003-110377 20030415; JP2003-275979 20030717; JP2003-326256 20030918; JP2004-042993 20040219; JP2004-055890 20040301
- International Application: PCT/JP2004/005365 WO 20040415
- International Announcement: WO2004/093186 WO 20041028
- Main IPC: H01L23/02
- IPC: H01L23/02
Abstract:
A metal base circuit board to be used for a hybrid integrated circuit, including circuits provided on a metal plate via an insulating layer, a power semiconductor mounted on the circuit, and a control semiconductor to control the power semiconductor, provided on the circuit. A low capacitance portion is embedded under a circuit portion on which the control semiconductor is mounted, preferably. The low capacitance portion is made of a resin containing an inorganic filler and has a dielectric constant of from 2 to 9.
Public/Granted literature
- US20070128772A1 Metal-base circuit board and its manufacturing method Public/Granted day:2007-06-07
Information query
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