Invention Grant
- Patent Title: Micro device encapsulation
- Patent Title (中): 微器件封装
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Application No.: US11379932Application Date: 2006-04-24
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Publication No.: US07709940B2Publication Date: 2010-05-04
- Inventor: Shaoher X. Pan , Wald Siskens
- Applicant: Shaoher X. Pan , Wald Siskens
- Applicant Address: US CA Sunnyvale
- Assignee: Spatial Photonics, Inc.
- Current Assignee: Spatial Photonics, Inc.
- Current Assignee Address: US CA Sunnyvale
- Agency: Fish & Richardson P.C.
- Main IPC: H01L23/02
- IPC: H01L23/02
Abstract:
A packaged die includes a substrate having an upper surface and a micro device on the upper surface and an encapsulation cover comprising one or more grooves on its lower surface. The lower surface of the encapsulation cover and the upper surface of the substrate are bonded together to form a plurality of air-tight closed-loop interfaces and encapsulate the micro device.
Public/Granted literature
- US20070249091A1 MICRO DEVICE ENCAPSULATION Public/Granted day:2007-10-25
Information query
IPC分类:
