Invention Grant
- Patent Title: Resin-sealed semiconductor device and method of manufacturing the same
- Patent Title (中): 树脂密封半导体器件及其制造方法
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Application No.: US11054039Application Date: 2005-02-08
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Publication No.: US07709941B2Publication Date: 2010-05-04
- Inventor: Toshikazu Imaoka , Takeshi Yamaguchi , Ryosuke Usui , Hiroyuki Watanabe , Toshimichi Naruse , Atsushi Kato
- Applicant: Toshikazu Imaoka , Takeshi Yamaguchi , Ryosuke Usui , Hiroyuki Watanabe , Toshimichi Naruse , Atsushi Kato
- Applicant Address: JP Osaka
- Assignee: Sanyo Electric Co., Ltd.
- Current Assignee: Sanyo Electric Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: Fish & Richardson P.C.
- Priority: JP2004-088054 20040324
- Main IPC: H01L23/02
- IPC: H01L23/02
Abstract:
A semiconductor pellet and chip components are provided on an insulating substrate, and are sealed with a molding resin that is molded by transfer molding. The chip components are positioned so as to surround the semiconductor pellet on all four sides. The lengthwise directions of the chip components surrounding the semiconductor pellet are aligned in a uniform direction. The insulating substrate is set within a die molding apparatus so that during resin injection, the lengthwise directions of the chip components are aligned substantially perpendicularly to the direction of flow of the injected resin.
Public/Granted literature
- US20050212146A1 Resin-sealed semiconductor device and method of manufacturing the same Public/Granted day:2005-09-29
Information query
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