An LED package is improved in heat radiating performance. The LED package includes a package substrate having heat radiating means; a heat radiating layer arranged on the package substrate with an area at least larger than a mounting area of a light emitting diode chip to provide a horizontal heat radiating path; and an electrically-connecting structure including first and second conductive leads arranged on the heat radiating layer. The light emitting diode chip is mounted on the heat radiating layer or the first conductive lead by a heat conductive adhesive layer.