中科微点-全球专利检索

  1. Login
  2. Sign Up
Invention Grant
US07709958B2 Methods and structures for interconnect passivation 失效
互连钝化的方法和结构

  • Patent Title: Methods and structures for interconnect passivation
  • Patent Title (中): 互连钝化的方法和结构
  • Application No.: US11156122
    Application Date: 2005-06-17
  • Publication No.: US07709958B2
    Publication Date: 2010-05-04
  • Inventor: Uri Cohen
  • Applicant: Uri Cohen
  • Main IPC: H01L23/48
  • IPC: H01L23/48
Methods and structures for interconnect passivation
Abstract:
One or more embodiments of the present invention relate to structures obtained by methods (a) for growing a film by an intermixing growth process, or (b) by depositing a film, which film includes chalcogenides of copper and/or silver (but excluding oxides), such as, for example, copper sulfide (CuSX and/or Cu2SX, where 0.7≦X≦1.3; and X=1.0 for stoichiometric compounds).
Abstract(Chinese):

本发明的一个或多个实施方案涉及通过用于通过混合生长方法生长膜的方法（a）获得的结构，或（b）通过沉积膜，该膜包括铜和/或银（但不包括氧化物）的硫族化物 ），例如硫化铜（CuSX和/或Cu2SX，其中0.7＆nlE; X＆lt; l1; 1.3;和X = 1.0的化学计量的化合物）。

Public/Granted literature
Information query
Espacenet
Patent Agency Ranking
0/0