Invention Grant
- Patent Title: Layout structure having a fill element arranged at an angle to a conducting line
- Patent Title (中): 布置结构具有与导线成角度布置的填充元件
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Application No.: US11553788Application Date: 2006-10-27
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Publication No.: US07709962B2Publication Date: 2010-05-04
- Inventor: Alexander Nielsen , Bernhard Dobler , Georg Georgakos
- Applicant: Alexander Nielsen , Bernhard Dobler , Georg Georgakos
- Applicant Address: DE Munich
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Munich
- Agency: Patterson & Sheridan, L.L.P.
- Main IPC: H01L29/40
- IPC: H01L29/40
Abstract:
A layout structure is provided with a conducting line extending in a conducting line direction, the conducting line being arranged within a substrate area, a fill element being arranged within the substrate area at a predetermined distance from the conducting line, the fill element having a fill element axis extending perpendicularly to a side of the fill element in a fill element direction, an angle between the conducting line direction and the fill element direction being greater than 0° and smaller than 90°.
Public/Granted literature
- US20080099790A1 LAYOUT STRUCTURE Public/Granted day:2008-05-01
Information query
IPC分类:
