Invention Grant
- Patent Title: Shapes-based migration of aluminum designs to copper damascene
- Patent Title (中): 基于形状的铝设计迁移到铜镶嵌
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Application No.: US11837723Application Date: 2007-08-13
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Publication No.: US07709967B2Publication Date: 2010-05-04
- Inventor: Timothy G. Dunham , Ezra D. B. Hall , Howard S. Landis , Mark A. Lavin , William C. Leipold
- Applicant: Timothy G. Dunham , Ezra D. B. Hall , Howard S. Landis , Mark A. Lavin , William C. Leipold
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Schmeiser, Olson & Watts
- Agent Yuanmin Cai
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
An interconnect structure, method of fabricating the interconnect structure and method of designing the interconnect structure for use in semiconductor devices. The interconnect structure includes a damascene metal wire having a pattern of dielectric filled holes.
Public/Granted literature
- US20070273048A1 SHAPES-BASED MIGRATION OF ALUMINUM DESIGNS TO COPPER DAMASCENE Public/Granted day:2007-11-29
Information query
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