Invention Grant
- Patent Title: Semiconductor integrated circuit
- Patent Title (中): 半导体集成电路
-
Application No.: US12323075Application Date: 2008-11-25
-
Publication No.: US07710142B2Publication Date: 2010-05-04
- Inventor: Ryo Hirano , Yukihide Suzuki , Hidekazu Egawa
- Applicant: Ryo Hirano , Yukihide Suzuki , Hidekazu Egawa
- Applicant Address: JP Tokyo
- Assignee: Elpida Memory, Inc.
- Current Assignee: Elpida Memory, Inc.
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2007-306789 20071128
- Main IPC: G01R31/02
- IPC: G01R31/02 ; G01R31/28
Abstract:
A semiconductor integrated circuit includes power supply pads of two or more kinds, switches each of which is connected between adjacent two of the power supply pads to allow short-circuiting them, and at least one control line connected to control terminals of the switches according to the kinds of the power supply pads connected to the switches.
Public/Granted literature
- US20090134892A1 SEMICONDUCTOR INTEGRATED CIRCUIT Public/Granted day:2009-05-28
Information query
