Invention Grant
- Patent Title: Semiconductor configuration having an integrated coupler and method for manufacturing such a semiconductor configuration
- Patent Title (中): 具有集成耦合器的半导体结构和用于制造这种半导体结构的方法
-
Application No.: US12025170Application Date: 2008-02-04
-
Publication No.: US07710215B2Publication Date: 2010-05-04
- Inventor: Uwe Wahl , Jens-Peer Stengl
- Applicant: Uwe Wahl , Jens-Peer Stengl
- Applicant Address: AT Villach
- Assignee: Infineon Technologies Austria AG
- Current Assignee: Infineon Technologies Austria AG
- Current Assignee Address: AT Villach
- Agency: Dickstein, Shapiro, LLP.
- Main IPC: H01P5/02
- IPC: H01P5/02 ; H01P3/08

Abstract:
A semiconductor configuration having an integrated coupler is provided. The semiconductor configuration includes a coupler which is integrated in the substrate and which includes a first port and a second port. The coupler defines, in a plan view onto the substrate, an inner region of the substrate surrounded at least in sections by the coupler, and an outer region of the substrate arranged outside to the coupler. The coupler is at least a magnetic coupler, a capacitive coupler, or a combination of both. At least a circuit element is integrated in the inner region of the substrate and includes a port which is electrically connected to the second port of the coupler.
Public/Granted literature
Information query