Invention Grant
- Patent Title: Control of eddy currents in magnetic vias for inductors and transformers in integrated circuits
- Patent Title (中): 控制集成电路中电感和变压器磁通孔中的涡流
-
Application No.: US12187130Application Date: 2008-08-06
-
Publication No.: US07710234B2Publication Date: 2010-05-04
- Inventor: Donald S. Gardner , Gerhard Schrom , Peter Hazucha , Fabrice Paillet , Tanay Kamik
- Applicant: Donald S. Gardner , Gerhard Schrom , Peter Hazucha , Fabrice Paillet , Tanay Kamik
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Kacvinsky LLC
- Main IPC: H01F5/00
- IPC: H01F5/00
Abstract:
An embodiment is a magnetic via. More specifically, an embodiment is a magnetic via that increases the inductance of, for example, an integrated inductor or transformer while mitigating eddy currents therein that may limit the operation of the inductor or transformer at high frequency.
Public/Granted literature
- US20080290980A1 CONTROL OF EDDY CURRENTS IN MAGNETIC VIAS FOR INDUCTORS AND TRANSFORMERS IN INTEGRATED CIRCUITS Public/Granted day:2008-11-27
Information query
