Invention Grant
- Patent Title: Keypad and/or touchpad construction
- Patent Title (中): 键盘和/或触摸板构造
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Application No.: US11645471Application Date: 2006-12-26
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Publication No.: US07710405B2Publication Date: 2010-05-04
- Inventor: Turo Keski-Jaskari
- Applicant: Turo Keski-Jaskari
- Applicant Address: FI Espoo
- Assignee: Nokia Corporation
- Current Assignee: Nokia Corporation
- Current Assignee Address: FI Espoo
- Agency: Harrington & Smith
- Main IPC: G06F3/041
- IPC: G06F3/041
Abstract:
A capacitive keypad and/or touchpad construction includes a flexible or rigid printed circuit board and a non-conductive keypad/touchpad top surface layer. A semi-conductive adhesive layer in between said flexible or rigid printed circuit board and said non-conductive keypad/touchpad top surface layer serves both to connect the top surface layer to the printed circuit board and to act as capacitive sensing layer.
Public/Granted literature
- US20080150912A1 Keypad and/or touchpad construction Public/Granted day:2008-06-26
Information query
