Invention Grant
- Patent Title: Surface position measuring system, exposure method and semiconductor device manufacturing method
- Patent Title (中): 表面位置测量系统,曝光方法和半导体器件制造方法
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Application No.: US11907190Application Date: 2007-10-10
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Publication No.: US07710583B2Publication Date: 2010-05-04
- Inventor: Takuya Kono
- Applicant: Takuya Kono
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
- Priority: JP2006-278071 20061011
- Main IPC: G01B11/14
- IPC: G01B11/14

Abstract:
There is provided a surface position measuring system which includes a reflectivity computing module which computes predictive reflectivities of a plurality of circuit patterns, an inspection light source which irradiates an inspection light onto each of a plurality of inspection areas, area by area, above the plurality of circuit patterns under irradiation conditions determined based on a corresponding each of the predictive reflectivities of the plurality of circuit patterns, and a photodetector which detects a reflected inspection light reflected from each of the plurality of inspection areas to detect a surface position of a corresponding each of the plurality of inspection areas.
Public/Granted literature
- US20080100843A1 Surface position measuring system, exposure method and semiconductor device manufacturing method Public/Granted day:2008-05-01
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