Invention Grant
- Patent Title: Assembly structure of flexible board and rigid board
- Patent Title (中): 柔性板和刚性板的装配结构
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Application No.: US11875886Application Date: 2007-10-20
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Publication No.: US07710740B2Publication Date: 2010-05-04
- Inventor: Chien-Liang Liu
- Applicant: Chien-Liang Liu
- Applicant Address: TW Taipei Hsien
- Assignee: Cheng Uei Precision Industry Co., Ltd.
- Current Assignee: Cheng Uei Precision Industry Co., Ltd.
- Current Assignee Address: TW Taipei Hsien
- Agency: WPAT, P.C.
- Agent Anthony King
- Main IPC: H05K1/11
- IPC: H05K1/11

Abstract:
An assembly structure of flexible board and rigid board includes a rigid board, a sub-board and a flexible board. The rigid board defines a locking gap having two side surfaces projecting toward each other to form two resisting portions. The sub-board has a standing portion inserted in the locking gap. Bilateral sides of the standing portion extend outward to form two preventing arms against a bottom surface of the rigid board. The flexible board has a base portion inserted in the locking gap of the rigid board. The base portion has a front surface and a back surface located to a front surface of the sub-board. The front surface of the base portion is against the resisting portions.
Public/Granted literature
- US20090103275A1 Assembly Structure of Flexible Board and Rigid Board Public/Granted day:2009-04-23
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