Invention Grant
- Patent Title: Electronic component mounting apparatus
- Patent Title (中): 电子元件安装装置
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Application No.: US11605471Application Date: 2006-11-29
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Publication No.: US07712208B2Publication Date: 2010-05-11
- Inventor: Akio Watanabe , Akihiro Kawai , Tetsuji Ono , Makio Kameda , Kazuyoshi Oyama , Kazuyoshi Ieizumi
- Applicant: Akio Watanabe , Akihiro Kawai , Tetsuji Ono , Makio Kameda , Kazuyoshi Oyama , Kazuyoshi Ieizumi
- Applicant Address: JP Ora-gun, Gunma
- Assignee: Hitachi High-Tech Instruments Co., Ltd.
- Current Assignee: Hitachi High-Tech Instruments Co., Ltd.
- Current Assignee Address: JP Ora-gun, Gunma
- Agency: Morrison & Foerster LLP
- Priority: JP2005-345114 20051130
- Main IPC: B23P19/00
- IPC: B23P19/00

Abstract:
The invention is directed to an unfailing pickup operation of an electronic component from a component storage portion at a seam of storage tapes connected even using a connection tape and prevention of reduction in a pickup rate of an electronic component. A CPU sends a feeding command to a component feeding unit to perform a component feeding operation or the like. Then, when the CPU judges that a connection tape reaches a pickup position, the CPU drives an X axis drive motor and a Y axis drive motor to move a board recognition camera to the pickup position of the feeding unit, the camera takes an image of a storage portion of a storage tape, and a recognition processing device performs recognition processing. A correction value based on a result of this recognition processing is stored in a RAM, and a suction nozzle is moved taking this correction value into account and lowers to pick up an electronic component.
Public/Granted literature
- US20070130756A1 Electronic component mounting apparatus Public/Granted day:2007-06-14
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